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Capabilities of PCB production

Capabilities of PCB production   /  PCB production   /  Main

Capabilities of PCB production

Projecting the PCB and reserving the order in our company our customer should take to consideration our technical requirements and production abilities. Basically Electroconnect Ltd seeks to the standard of IPC--600F, which includes and describes the criterion of formal acceptance. Our PCB production provides with devices for hand-made and automatic soldering, SMT technology, with the standards which are adequate to IPC-A-600, GOST 23751-86 requirements.

At the present moment we offer PCB production of A and B complexity class.

Class A - meet the main parameters from 1st to 4th class of complexity in accordance with GOST 23751-86. It should be noted, that GOST 23751-86 had been functioning till 01.07.1992 and described positive method of infrared fusion of Electrolytic Tin-Lead deposition. Furthermore GOST 23751-86 doesn't include the description of solder mask, HASL and immersion coating. For this parameters and deformation parameters we apply the standards of IPC.

Class B - requires more attention of our technologists and additional inspection stages of producing, comparing to class A.


The description of PCB parameters, which determine the class of PCB complexity, are indicated below.



Parameters

Class A

Class B

Accuracy class GOST 23751-86

1 - 4

4, 5 and HDI

Layer quantity

1 - 6

8 - 16

Maximum size:
Single-and double-sided PCB
MLB


428 2832
413,5 273,25


call
call

Counter position tolerance

± 200

± 200

PCB size tolerance

h12

h12

Non plated hole, inner chase and space tolerance

H12

H12

Solder mask

LPI

DRY FILM, LPI

The color of the solder mask

green

green, red, black, blue, white

Legend

white

black, green

Final finish

HAL

HAL, ImAu, ImSn

Gold Finger

Ni, NiAu

Ni, NiAu

The Carbon covering of keyboard field (New!)

Graphite

Buried plated hole

1:1

Blind plated hole

call

Notes:

1. Parameters can be specified

2. Max = 428x273 or 418x283





Parameters

Class A

Class B

A

Total thickness tolerance:

SS DS PCB

0,5, 0,71, 1,0, 1,5, 2,0 ± 10 %

0.1, call

MLB

1,2...2,5 ± 10 %

0,6...3,5 ± 10 %

Deformation

1,0

1,0

Minimum Plated hole diameter (for 1,5 mm PCB thickness)

0,4 (4:1)

0,25 (6:1)

Maximum plated hole diameter, mm

4,5

-

C

Minimum Annular ring plated hole, um

200

120

D

Minimum Annular inner layer pad , um

300

200

K

Minimum annular ring non plated hole

300

200

E

Maximum Non plated hole diameter (tenting) mm

3,5

4,5

L

Maximum Non plated hole diameter (counter routing)

no limits

no limits

F

The gap: non plated hole/ cooper space, um

300

200

M

minimum width of plated/ non-plated inner chase,mm

1,0

0,8

G

the gap drill to inner layer pad, um

400

250

H

The gap: cooper space/ pad, um

200

200

I, U

Track from board edge to cooper space, minimum , um:

 

 

counter routing

300

250

v-cutting

500

500

J

The gap board edge/ non-plated hole minimum spacing

300

250

:

1. Parameters can be specified

2. The deviation of the diameters of through-holes and plated holes satisfy GOST 23751-86 tab 2.

Parameters

Class A

Class B

N

Minimum conductor width, um, foil:

 

 

18 um 30 um

200

120

35 um 50 um

250

200

50 um 70 um

270

230

70 um 100 um

300

250

105 um 120 um

350

300

O

Minimum gap conductor/ conductor/pad, um foil:

 

 

18 um 30 um

200

120

35 um 50 um

250

200

50 um 70 um

270

230

70 um 100 um

300

250

105 um 120 um

350

300

Q

Conductive ink to pad spacing, um

100

75

The width of mask strip minimum, um

100

75

S.

The space from conductor to mask edge spacing

100

75

T.

The gap conductor/ non-plated hole minimum, um

350

250

U, I³

Track from cooper area to board edge minimum spacing, um:

 

 

counter routing

300

250

v-cutting

500

500

V.

Legend minimum line, um

150

150

W.

Minimum legend symbol height, mm

1,3

1,3

X.

The space from symbol to pad

200

200

Notes:

1. Parameters can be specified.

2. For black colored solder mask parameter R- the width of mask strip, needs to be specified before the order. By default it is 150 um.

3. Parameters I and U, track from board edge to cooper space depend on PCB machining, to specify the way of PCB separation click here.

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© 2008 «Electroconnect Ltd»

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